Press apparatus and pressing method thereof

ABSTRACT

A press apparatus includes: a stage to support a first substrate and a second substrate of a display device; a fixing member to fix a flexible printed circuit board connected with the first substrate onto the second substrate; and a press member to press first pad electrodes of the flexible printed circuit board and second pad electrodes of the second substrate, and the fixing member is configured to press a pad electrode-free area of the flexible printed circuit board. A pressing method of a press apparatus is also provided.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority to and the benefit of Korean PatentApplication No. 10-2016-0142265, filed on Oct. 28, 2016 in the KoreanIntellectual Property Office, the entire content of which isincorporated herein by reference.

BACKGROUND 1. Field

Aspects of embodiments of the present disclosure relate to a pressapparatus and a pressing method thereof.

2. Description of the Related Art

A display device refers to a device displaying an image signal. Thedisplay device may include a liquid crystal display device (LCD), aplasma display panel device (PDP), a field emission display device(FED), an organic light emitting device (OLED), or an electrophoreticdisplay device (EPD), for example.

Recently, research is being actively conducted on a flexible displaydevice, which uses a flexible material, such as plastic, such that eventhough the display device is bent like a paper, display performance ismaintained. The flexible display device uses a flexible substrate havingimproved flexibility, and a plastic or resin material may be used as amaterial of the flexible substrate.

SUMMARY

According to aspects of the present disclosure, a press apparatus iscapable of precisely pressing a flexible printed circuit board to asubstrate of a display device, and a pressing method thereof is alsoprovided.

According to an exemplary embodiment of the present disclosure, a pressapparatus includes: a stage to support a first substrate and a secondsubstrate of a display device; a fixing member to fix a flexible printedcircuit board connected with the first substrate onto the secondsubstrate; and a press member to press first pad electrodes of theflexible printed circuit board and second pad electrodes of the secondsubstrate, and the fixing member is configured to press a padelectrode-free area of the flexible printed circuit board.

The fixing member may include a press jig to press the padelectrode-free area.

The press jig may include a first surface contactable with the padelectrode-free area, and a second surface surrounding a circumference ofthe first surface.

The first surface may be a planar surface.

The first surface may be a curved surface.

The press jig may be shiftable in a direction vertical to the stage ormay be shiftable in a direction parallel to the stage.

The press jig may be contactable with the pad electrode-free area, andthen may be shiftable toward the first substrate.

The fixing member may include a guide pin passable through a firstcoupling hole formed in the flexible printed circuit board and a secondcoupling hole formed in the second substrate.

A part of the guide pin may be configured to press the padelectrode-free area.

At least one of the first substrate or the second substrate may beflexible.

The first pad electrodes, the first coupling hole, and the padelectrode-free area is sequentially located toward the first substrate.

The first substrate may be a touch substrate, and the second substratemay be a touch circuit substrate driving the touch substrate.

According to an aspect of another exemplary embodiment of the presentdisclosure, a pressing method of a press apparatus includes: providing afirst substrate connected with a flexible printed circuit board onto astage; providing a second substrate onto the stage; arranging theflexible printed circuit board on the second substrate; pressing a padelectrode-free area of the flexible printed circuit board; and pressingfirst pad electrodes of the flexible printed circuit board and secondpad electrodes of the second substrate.

The pressing of the pad electrode-free area may include: passing a guidepin through a first coupling hole formed in the flexible printed circuitboard and a second coupling hole formed in the second substrate; andpressing the pad electrode-free area by using the guide pin.

The pressing of the pad electrode-free area may include pressing the padelectrode-free area of the flexible printed circuit board by using apress jig.

The pressing of the pad electrode-free area of the flexible printedcircuit board by using the press jig may include: contacting the padelectrode-free area with the press jig; and shifting the press jigtoward the first substrate.

According to an exemplary embodiment of the present disclosure, a pressapparatus includes: a stage to support a first substrate and a secondsubstrate of a display device; a guide pin to fix a flexible printedcircuit board connected with the first substrate onto the secondsubstrate; a press member to press first pad electrodes of the flexibleprinted circuit board and second pad electrodes of the second substrate;and a press jig to press a pad electrode-free area of the flexibleprinted circuit board.

The guide pin may be passable through a first coupling hole formed inthe flexible printed circuit board and a second coupling hole formed inthe second substrate.

The first substrate may be a touch substrate, and the second substratemay be a touch circuit substrate driving the touch substrate.

The first pad electrodes, the first coupling hole, and the padelectrode-free area may be sequentially located toward the firstsubstrate.

According to aspects of a press apparatus and a pressing method thereofaccording to one or more exemplary embodiments of the presentdisclosure, a pad electrode-free area of a flexible printed circuitboard is pressed by using the press jig, such that it is possible toprevent or substantially prevent tension generated by the padelectrode-free area from influencing contact areas between padelectrodes of the flexible printed circuit board and pad electrodes of asubstrate. Accordingly, the pad electrodes of the flexible printedcircuit board and the pad electrodes of the substrate may be aligned soas to correspond to one another, and the substrate and the flexibleprinted circuit board may be precisely pressed.

BRIEF DESCRIPTION OF THE DRAWINGS

Some example embodiments will be described more fully herein withreference to the accompanying drawings; however, the present disclosuremay be embodied in different forms and should not be construed aslimited to the example embodiments set forth herein. Rather, theseembodiments are provided so that this disclosure will be thorough andcomplete, and will fully convey the scope of the present disclosure tothose skilled in the art.

In the drawing figures, dimensions may be exaggerated for clarity ofillustration. Like reference numerals refer to like elements throughout.

FIG. 1 is a schematic top plan view illustrating a display deviceaccording to an exemplary embodiment of the present disclosure.

FIGS. 2A, 2B, 2C, and 2D are schematic cross-sectional views fordescribing a pressing method of a press apparatus according to anexemplary embodiment of the present disclosure.

FIGS. 3A, 3B, 3C, and 3D are schematic cross-sectional views fordescribing a pressing method of a press apparatus according to anotherexemplary embodiment of the present disclosure.

FIGS. 4A, 4B, and 4C are schematic cross-sectional views for describinga pressing method of a press apparatus according to another exemplaryembodiment of the present disclosure.

FIGS. 5A and 5B are schematic perspective views for describing apressing method of a press apparatus according to an exemplaryembodiment of the present disclosure.

FIGS. 6A and 6B are schematic perspective views for describing apressing method of a press apparatus according to another exemplaryembodiment of the present disclosure.

FIGS. 7A, 7B, and 7C are schematic cross-sectional views of press jigsaccording to an exemplary embodiment of the present disclosure.

FIG. 8 is a top plan view illustrating a first substrate of a displaydevice according to an exemplary embodiment of the present disclosure.

FIG. 9 is a flowchart for describing a pressing method of a pressapparatus according to an exemplary embodiment of the presentdisclosure.

DETAILED DESCRIPTION

In some exemplary embodiments according to the present disclosuredescribed herein, any specific structural or functional descriptionprovided is simply illustrative for the purpose of explaining theexemplary embodiments according to the concept of the presentdisclosure. However, the concept of the present disclosure may becarried out in various forms, and the present disclosure is not limitedto the exemplary embodiments described herein.

Further, the exemplary embodiments according to the concept of thepresent disclosure may be variously modified and have various forms,even though some specific exemplary embodiments are illustrated in thedrawings and described in further detail herein. However, this is notintended to limit the exemplary embodiments according to the concept ofthe present disclosure to specific disclosed forms, and the presentdisclosure includes all of the changes, the equivalent matters, or thereplacement matters included in the spirit and the technical scope ofthe present disclosure.

Terms, such as “first,” “second,” and the like may be used fordescribing various constituent elements, but the constituent elementsare not to be limited by the terms. Rather, these terms are used onlyfor the purpose of discriminating one constituent element from anotherconstituent element, for example, without departing from the scopeaccording to the concept of the present disclosure, and a firstconstituent element may be named as a second constituent element, andsimilarly a second constituent element may be named as a firstconstituent element. Further, it is to be understood that when anelement is referred to as being “between” two elements, it can be theonly element between the two elements, or one or more interveningelements may also be present.

Terms used in the present application are used only to describe specificexemplary embodiments, and are not intended to limit the presentdisclosure. As used herein, the singular forms are intended to includethe plural forms as well, unless the context clearly indicatesotherwise. In this specification, it is to be understood that the terms“include” or “have” indicate that a feature, a number, a step, anoperation, a component, a part, or a combination thereof described inthe specification is present, but does not exclude a possibility ofpresence or addition of one or more other features, numbers, steps,operations, components, parts, or combinations thereof.

Unless they are contrarily defined, all terms used herein includingtechnological or scientific terms have the same meaning as thosegenerally understood by a person with ordinary skill in the art. Termswhich are defined in a generally used dictionary should be interpretedto have the same meaning as the meaning in the context of the relatedart, but are not to be interpreted to have an ideally or excessivelyformal meaning if it is not clearly defined herein.

Herein, some exemplary embodiments of the present disclosure will bedescribed in further detail with reference to the accompanying drawings.

FIG. 1 is a schematic top plan view illustrating a display deviceaccording to an exemplary embodiment of the present disclosure.

Referring to FIG. 1, a display device 10 according to an exemplaryembodiment of the present disclosure may include a first substrate SUB1,a second substrate SUB2, a third substrate SUB3, and a flexible printedcircuit board FPC.

In an embodiment, the first to third substrates SUB1 to SUB3 may beprovided in a rectangular plate shape having two pairs of parallelsides. In the first to third substrates SUB1 to SUB3, any one pair ofsides of the two pairs of sides may be provided to be longer than theother pair of sides, but the first to third substrates SUB1 to SUB3 arenot limited thereto.

For example, the first to third substrates SUB1 to SUB3 may be providedin any of various shapes, such as a polygon having a closed shapeincluding a straight side, a circle or an ellipse including a curvedside, or a semicircle or a half ellipse including a side formed of astraight line and a curved line.

In an embodiment, the first substrate SUB1 may include a touch sensorrecognizing a touch. The touch sensor may be implemented in a capacitivemethod or a piezoresistive method.

For example, the first substrate SUB1 may include driving electrodes andsensing electrodes, and may detect capacitance which is varied inresponse to a touch event generated by a hand of a user or a separateinput means. The touch sensor may be configured by a mutual capacitancemethod or a self-capacitance method.

In an embodiment, the second substrate SUB2 may include a touch drivingcircuit controlling a touch detection of the first substrate SUB1.

For example, the touch driving circuit may provide a driving signal tothe first substrate SUB1 through the flexible printed circuit board FPC,or may detect a touch position by using a detection signal provided fromthe first substrate SUB1.

In an embodiment, the third substrate SUB3 may include a display unitincluding pixels. For example, each of the pixels is a minimum unitdisplaying an image, and may be disposed on the third substrate SUB3.For example, the pixel may emit any one of red, green, and blue, but isnot limited thereto, and may emit a color, such as cyan, magenta, oryellow.

The third substrate SUB3 may display visual information (e.g.,predetermined visual information), for example, text, a video, apicture, or a 2D or 3D image, through the pixels. The kind of displayunit is not particularly limited as long as the display unit displays animage, and may include any of an organic light emitting display panel, aliquid crystal display panel, and a plasma display panel.

In an embodiment, a fourth substrate SUB4 may be connected to the thirdsubstrate SUB3 and include a driving IC for driving the display unit.

One side of the flexible printed circuit board FPC may be attached tothe first substrate SUB1, and the other side thereof may be attached tothe second substrate SUB2.

The flexible printed circuit board FPC may be electrically connectedwith the first substrate SUB1 through pad electrodes formed in a firstcontact area CONT1, and may be electrically connected with the secondsubstrate SUB2 through pad electrodes formed in a second contact areaCONT2.

Further, the flexible printed circuit board FPC may include a firstcoupling hole H1 into which a guide pin may be inserted. During apressing process for electrically connecting the flexible printedcircuit board FPC and the second substrate SUB2, the guide pin may passthrough the first coupling hole H1 to align the pad electrodes formed inthe flexible printed circuit board FPC and the pad electrodes formed onthe second substrate SUB2.

According to an exemplary embodiment, the fourth substrate SUB4 and theflexible printed circuit board FPC may be implemented by any of a chipon glass, a chip on plastic, a tape carrier package, a chip on film, andthe like.

Further, the first to third substrates SUB1 to SUB3 may be flexiblesubstrates, and may be implemented by any one of a film including apolymer organic material having a flexible characteristic and a plasticsubstrate.

According to an exemplary embodiment, the first to third substrates SUB1to SUB3 may be formed of at least one of polyimide (PI), polyethyleneterephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC),polyarylate (PAR), polyetherimide (PEI), polyethersulphone (PES),polyethylene etherphthalate, poly arylate, and polyacrylate, but are notlimited thereto, and the first to third substrates SUB1 to SUB3 may beformed of a plastic film formed of an organic material or variousflexible materials, such as metal foil or a thin film.

FIGS. 2A, 2B, 2C, and 2D are schematic cross-sectional views fordescribing a pressing method of a press apparatus according to anexemplary embodiment of the present disclosure.

FIGS. 2A to 2D are cross-sectional views schematically illustrating thedisplay device 10 taken along line I-I′ of FIG. 1 for convenience of thedescription of the pressing method by a press apparatus 100.

Referring to FIG. 2A, the press apparatus 100 according to an exemplaryembodiment of the present disclosure may include a first stage ST1, asecond stage ST2, a fixing member FM including a guide pin PIN and apress jig JIG, and a press member PM.

The first stage ST1 may support the third substrate SUB3 and the firstsubstrate SUB1 disposed on the third substrate SUB3. Further, the thirdsubstrate SUB3 may be connected with the fourth substrate SUB4 includinga driving IC IC1 controlling the driving of the third substrate SUB3.Further, the first stage ST1 may stably fix the first and thirdsubstrates SUB1 and SUB3 so as to prevent or substantially prevent thefirst and third substrates SUB1 and SUB3 from moving.

Pad electrodes PDs1 of the first substrate SUB1 may be connected withfirst pad electrodes PDs2 a of the flexible printed circuit board FPC.In an embodiment, the pad electrodes PDs1 of the first substrate SUB1may be electrically connected with the first pad electrode PDs2 a of theflexible printed circuit board FPC by a previously performed pressingprocess.

The second stage ST2 may support the second substrate SUB2, and maystably fix the second substrate SUB2 so as to prevent or substantiallyprevent the second substrate SUB2 from moving. The second substrate SUB2may be connected with the fourth substrate SUB4, and may include adriving IC IC2 that is capable of controlling the driving of the firstsubstrate SUB1.

In an exemplary embodiment of the present disclosure, it is illustratedthat the first stage ST1 and the second stage ST2 are separate elementswhich are disposed while being spaced apart from each other; however,the first stage ST1 and the second stage ST2 are not limited thereto,and may be implemented with one stage.

In order to perform the pressing process between the flexible printedcircuit board FPC and the second substrate SUB2, the flexible printedcircuit board FPC may be disposed on the second substrate SUB2.Particularly, second pad electrodes PDs2 b of the flexible printedcircuit board FPC may be disposed on pad electrodes PDs3 of the secondsubstrate SUB2.

Since the flexible printed circuit board FPC and the fourth substrateSUB4 may be bent to a rear surface of the third substrate SUB3 in asubsequent process after the pressing process, the flexible printedcircuit board FPC is formed to be longer than the fourth substrate SUB4according to a position design of the flexible printed circuit board FPCand the fourth substrate SUB4. Accordingly, a lifted area AR isgenerated in the flexible printed circuit board FPC. The lifted area ARis a pad electrode-free area. The pad electrodes PDs2 b, the firstcoupling hole H1, and the lifted area AR are sequentially located towardthe first substrate SUB1.

Referring to FIG. 28, the press apparatus 100 may fix the flexibleprinted circuit board FPC by using the guide pin PIN such that theflexible printed circuit board FPC does not move on the second substrateSUB2. Particularly, the press apparatus 100 may pass the guide pin PINthrough the first coupling hole H1 of the flexible printed circuit boardFPC and the second coupling hole H2 of the second substrate SUB2 toalign the second pad electrodes PDs2 b of the flexible printed circuitboard FPC and the pad electrodes PDs3 of the second substrate SUB2 toface one another.

In an embodiment, a diameter of the guide pin PIN does not completelycorrespond to a diameter of the first coupling hole H1, such that a gapmay be generated between the guide pin PIN and the first coupling holeH1. Accordingly, the guide pin PIN may be positioned to be biased to oneside within the first coupling hole H1 by tension generated in thelifted area AR of the flexible printed circuit board FPC. The second padelectrodes PDs2 b of the flexible printed circuit board FPC and the padelectrodes PDs3 of the second substrate SUB2 may be alternately disposedby the tension generated in the lifted area AR of the flexible printedcircuit board FPC.

Referring to FIG. 2C, the press apparatus 100 may align the second padelectrodes PDs2 b of the flexible printed circuit board FPC and the padelectrodes PDs3 of the second substrate SUB2 to correspond to oneanother by the press jig JIG.

The press jig JIG may press a region adjacent to the guide pin PIN inthe flexible printed circuit board FPC to cause the lifted area AR to beflat. That is, the press jig JIG may press the lifted area AR adjacentto the guide pin PIN to block tension generated by the lifted area AR.

Since the first coupling hole H1 is not influenced by the tensiongenerated from the lifted area AR, the guide pin PIN may be disposed ata target position within the first coupling hole H1, and the second padelectrodes PDs2 b of the flexible printed circuit board FPC may bealigned on the pad electrodes PDs3 of the second substrate SUB2 so as tocorrespond to the pad electrodes PDs3 of the second substrate SUB2.

Further, although not illustrated in FIGS. 2A to 2D, the press apparatus100 according to an exemplary embodiment of the present disclosure mayinclude a shifting member.

The shifting member may shift the press jig JIG in a direction verticalto the second stage ST2 or may shift the press jig JIG in a directionparallel to the second stage ST2.

According to an exemplary embodiment, the shifting member may shift thepress jig JIG by using a transport rail.

For example, the shifting member may shift the press jig JIG such thatthe press jig JIG is in contact with the lifted area AR of the flexibleprinted circuit board FPC and then moves away from the guide pin PIN. Inthis case, according to the shift of the press jig JIG, the flexibleprinted circuit board FPC may receive the tension in the shift directionof the shifting member, and the first coupling hole H1 coupled with theguide pin PIN may also receive the tension in the shift direction. Thatis, the shifting member may shift the first coupling hole H1 in thedirection of the tension, and adjust a position of the guide pin PINwithin the first coupling hole H1. Through the process, the second padelectrodes PDs2 b of the flexible printed circuit board FPC may bedisposed on the third pad electrodes PDs3 of the second substrate SUB2.

FIG. 2C illustrates that the press jig JIG presses the lifted area AR ofthe flexible printed circuit board FPC outside the second stage ST2, butthe present disclosure is not limited thereto, and the press jig JIG maypress the lifted area AR of the flexible printed circuit board FPC onthe second stage ST2.

Referring to FIG. 2D, the press member PM may press the second padelectrodes PDs2 b of the flexible printed circuit board FPC and the padelectrodes PDs3 of the second substrate SUB2 to electrically connect thesecond pad electrodes PDs2 b of the flexible printed circuit board FPCand the pad electrodes PDs3 of the second substrate SUB2. In anembodiment, for example, the press member PM may heat the second padelectrodes PDs2 b and the pad electrodes PDs3 at a temperature (e.g., apredetermined temperature) to bond the second pad electrodes PDs2 b andthe pad electrodes PDs3.

FIGS. 3A, 3B, 3C, and 3D are schematic cross-sectional views fordescribing a pressing method of a press apparatus according to anotherexemplary embodiment of the present disclosure.

In order to avoid repeating description, in FIGS. 3A, 3B, 3C, and 3D,aspects different from those of the exemplary embodiment shown in FIGS.2A, 2B, 2C, and 2D will be mainly described. Parts which are notspecifically described with reference to FIGS. 3A, 3B, 3C, and 3D willfollow those of the aforementioned exemplary embodiment, and the samereference numeral refers to the same element, and the similar referencenumeral refers to the similar element.

Referring to FIGS. 3A and 3B, a press apparatus 100′ according toanother exemplary embodiment of the present disclosure may include afirst stage ST1, a second stage ST2, a guide pin PIN′, and a pressmember PM.

The press apparatus 100′ may fix a flexible printed circuit board FPC byusing the guide pin PIN′ such that the flexible printed circuit boardFPC does not move on a second substrate SUB2. Particularly, the pressapparatus 100′ may pass the guide pin PIN′ through a first coupling holeH1 of the flexible printed circuit board FPC and a second coupling holeH2 of the second substrate SUB2 to align second pad electrodes PDs2 b ofthe flexible printed circuit board FPC and pad electrodes PDs3 of thesecond substrate SUB2 to face one another.

In an embodiment, a diameter of the guide pin PIN′ does not completelycorrespond to a diameter of the first coupling hole H1, such that a gapmay be generated between the guide pin PIN′ and the first coupling holeH1. Accordingly, the guide pin PIN′ may be positioned to be biased toone side within the first coupling hole H1 by tension generated in alifted area AR of the flexible printed circuit board FPC. The second padelectrodes PDs2 b of the flexible printed circuit board FPC and the padelectrodes PDs3 of the second substrate SUB2 may be alternately disposedby the tension generated in the lifted area AR of the flexible printedcircuit board FPC.

Referring to FIG. 3C, the press apparatus 100′ may align the second padelectrodes PDs2 b of the flexible printed circuit board FPC and the padelectrodes PDs3 of the second substrate SUB2 to correspond using theguide pine PIN′.

The guide pin PIN′ may be partially bent or folded in a direction of afirst substrate SUB1 to press the lifted area AR, thereby blocking thetension generated in the lifted area AR.

Since the first coupling hole H1 is not influenced by the tensiongenerated from the lifted area AR, the guide pin PIN′ may be disposed ata target position within the first coupling hole H1, and the second padelectrodes PDs2 b of the flexible printed circuit board FPC may bealigned on the pad electrodes PDs3 of the second substrate SUB2 so as tocorrespond to the pad electrodes PDs3 of the second substrate SUB2.

FIG. 3C illustrates a rectangular guide pin PIN′, a part of which isbent or folded; however, the present disclosure is not limited thereto,and a shape of the guide pin PIN′ may have any of various shapes.

Referring to FIG. 3D, the press member PM may press the second padelectrodes PDs2 b of the flexible printed circuit board FPC and the padelectrodes PDs3 of the second substrate SUB2 to electrically connect thesecond pad electrodes PDs2 b of the flexible printed circuit board FPCand the pad electrodes PDs3 of the second substrate SUB2. In anembodiment, for example, the press member PM may heat the second padelectrodes PDs2 b and the pad electrodes PDs3 at a temperature (e.g., apredetermined temperature) to bond the second pad electrodes PDs2 b andthe pad electrodes PDs3.

FIGS. 4A, 4B, and 4C are schematic cross-sectional views for describinga pressing method of a press apparatus according to another exemplaryembodiment of the present disclosure.

In order to avoid repeating description, in FIGS. 4A, 4B, and 4C,aspects different from those of the aforementioned exemplary embodimentswill be mainly described. Parts which are not specifically describedwith reference to FIGS. 4A, 4B, and 4C will follow those of theaforementioned exemplary embodiments, and the same reference numeralrefers to the same element, and the similar reference numeral refers tothe similar element.

Referring to FIGS. 4A and 4B, a press apparatus 100″ according to anexemplary embodiment of the present disclosure may include a first stageST1, a second stage ST2, a guide pin PIN″, and a press member PM.

The press apparatus 100″ may fix a flexible printed circuit board FPC byusing the guide pin PIN″ such that the flexible printed circuit boardFPC does not move on a second substrate SUB2. In an embodiment, thepress apparatus 100″ may pass the guide pin PIN″ through a firstcoupling hole H1 of the flexible printed circuit board FPC and a secondcoupling hole H2 of the second substrate SUB2 to align second padelectrodes PDs2 b of the flexible printed circuit board FPC and padelectrodes PDs3 of the second substrate SUB2 to face one another.

Further, the guide pin PIN″ may press a lifted area AR to cause thelifted area AR to be flat, thereby blocking tension generated by thelifted area AR.

As described above, the guide pin PIN″ may press the lifted area ARwhile passing through the first coupling hole H1 and the second couplinghole H2, such that it is possible to more easily align the second padelectrodes PDs2 b of the flexible printed circuit board FPC and the padelectrodes PDs3 of the second substrate SUB2 such that the second padelectrodes PDs2 b of the flexible printed circuit board FPC correspondto the pad electrodes PDs3 of the second substrate SUB2.

Referring to FIG. 4C, the press member PM may press the second padelectrodes PDs2 b of the flexible printed circuit board FPC and the padelectrodes PDs3 of the second substrate SUB2 to electrically connect thesecond pad electrodes PDs2 b of the flexible printed circuit board FPCand the pad electrodes PDs3 of the second substrate SUB2. In anembodiment, for example, the press member PM may heat the second padelectrodes PDs2 b and the pad electrodes PDs3 at a temperature (e.g., apredetermined temperature) to bond the second pad electrodes PDs2 b andthe pad electrodes PDs3.

FIGS. 5A and 5B are schematic perspective views for describing apressing method of a press apparatus according to an exemplaryembodiment of the present disclosure.

In order to avoid repeating description, in FIGS. 5A and 5B, aspectsdifferent from those of the aforementioned exemplary embodiments will bemainly described. Parts which are not specifically described withreference to FIGS. 5A and 5B will follow those of the aforementionedexemplary embodiments, and the same reference numeral refers to the sameelement, and the similar reference numeral refers to the similarelement.

Referring to FIGS. 5A and 5B, a press jig JIG′ may include an elongatedfirst side, and two second sides, which are extended from both ends ofthe first side in a vertical direction.

One side of the second side is connected to a second stage ST2, suchthat the press jig JIG′ may be fixed, and the press jig JIG′ may move ina direction vertical to the first side under the control of a shiftingmember.

The press jig JIG′ may press a lifted area AR of a flexible printedcircuit board FPC disposed on the second stage ST2, and the flexibleprinted circuit board FPC in a region adjacent to a guide pin PIN may becaused to be flat.

FIGS. 6A and 6B are schematic perspective views for describing apressing method of a press apparatus according to another exemplaryembodiment of the present disclosure.

In order to avoid repeating description, in FIGS. 6A and 6B, aspectsdifferent from those of the aforementioned exemplary embodiments will bemainly described. Parts which are not specifically described withreference to FIGS. 6A and 6B will follow those of the aforementionedexemplary embodiments, and the same reference numeral refers to the sameelement, and the similar reference numeral refers to the similarelement.

Referring to FIGS. 6A and 6B, a press jig JIG″ may include a first sideextended in a first direction (e.g., a predetermined direction), and asecond side bent in a second direction different from the firstdirection and extended.

The first side is connected to a second stage ST2, such that the pressjig JIG″ may be fixed, and the second side may move in a direction inwhich a flexible printed circuit board FPC is positioned, under thecontrol of a shifting member.

The press jig JIG″ may press a lifted area AR of the flexible printedcircuit board FPC disposed on the second stage ST2, and the flexibleprinted circuit board FPC in a region adjacent to a guide pin PIN may becaused to be flat.

FIGS. 7A, 7B, and 7C are schematic cross-sectional views of press jigsaccording to exemplary embodiments of the present disclosure.

FIGS. 7A, 7B, and 7C are cross-sectional views of parts of press jigsJIG1, JIG2, and JIG3 according to exemplary embodiments of the presentdisclosure, and the shape of the press jigs JIG1, JIG2, and JIG3 are notlimited thereto, and may be any of various shapes.

The press jigs JIG1, JIG2, and JIG3 illustrated in FIGS. 7A, 7B, and 7Cmay include respective first surfaces A1, A1′, and A1″, which are incontact with a lifted area of a flexible printed circuit board FPC, andsecond surfaces A2, A2′, and A2″, which surround the first surfaces A1,A1′, and A1″, respectively.

Referring to FIG. 7A, the first surface A1 of the press jig JIG1 may beformed as a curved surface. When the press jig JIG1 is in contact withthe flexible printed circuit board FPC, a part of the first surface A1may be in contact with the lifted area AR by the curved shape of thefirst surface A1, but the remaining part of the first surface A1 may notbe in contact with the lifted area AR. Accordingly, the flexible printedcircuit board FPC may receive a minimum or reduced pressing force fromthe press jig JIG1, thereby being prevented or substantially preventedfrom being damaged by the pressing force.

Referring to FIG. 7B, the first surface A1′ of the press jig JIG2 may beformed as a planar surface having a smaller thickness than a thicknessof the press jig JIG2.

When the first surface A1′ of the press jig JIG2 is in contact with theflexible printed circuit board FPC, the flexible printed circuit boardFPC may receive only a minimum or reduced pressing force from therelatively small area of the first surface A1′. Accordingly, theflexible printed circuit board FPC may be prevented or substantiallyprevented from being damaged by the pressing force.

Referring to FIG. 7C, the first surface A1″ of the press jig JIG3 may beformed in a direction that is not vertical to the second surface A2″.Accordingly, a part of the first surface A1″ may be in contact with thelifted area AR, but the remaining part of the first surface A1″ may notbe in contact with the lifted area AR. Accordingly, the flexible printedcircuit board FPC may receive a minimum or reduced pressing force fromthe press jig JIG3, thereby being prevented or substantially preventedfrom being damaged by the pressing force.

FIG. 8 is a top plan view illustrating a first substrate of a displaydevice according to an exemplary embodiment of the present disclosure.

Referring to FIG. 8, a first substrate SUB1 according to an exemplaryembodiment of the present disclosure may include a first sub substrateSUB1 a, driving electrodes Tx, sensing electrodes Rx, and pad electrodesPDs1.

The driving electrodes Tx and the sensing electrodes Rx may be formed onthe sub substrate SUB1 a so as to cross one another.

The driving electrodes Tx may be extended in a first direction (forexample, an x-axis direction) and the plurality of driving electrodes Txmay be disposed in a second direction (for example, a y-axis direction)crossing the first direction. The sensing electrodes Rx may be extendedin the second direction, and the plurality of sensing electrodes Rx maybe disposed in the first direction.

The driving electrodes Tx may include a plurality of driving cells TxParranged in the first direction with an interval (e.g., a predeterminedinterval), and a plurality of driving patterns TxB electricallyconnecting the driving cells TxP.

The sensing electrodes Rx may include a plurality of sensing cells RxParranged in the second direction with an interval (e.g., a predeterminedinterval) and distributed between the driving cells TxP so as not tooverlap the driving cells TxP, and a plurality of sensing patterns RxBelectrically connecting the sensing cells RxP.

The driving cells TxP and the sensing cells RxP may be formed of atransparent conductive material, such as any of an indium tin oxide(ITO), a carbon nano tube (CNT), and graphene, for example.

Further, the driving cells TxP and the sensing cells RxP may be formedof any of the aforementioned transparent conductive materials or a metalmaterial.

Driving lines DL may be connected between the driving cells TxP and padelectrodes PDs1, and sensing lines SL may be connected between thesensing cells RxP and the pad electrodes PDs1.

According to an exemplary embodiment, each of the driving lines DL andthe sensing lines SL may be formed of a transparent conductive material,but is not limited thereto, and may be formed of a low resistancematerial, such as molybdenum (Mo), silver (Ag), titanium (Ti), copper(Cu), aluminum (Al), or molybdenum/aluminum/molybdenum (Mo/Al/Mo), forexample.

Further, the pad electrodes PDs1 may be connected with first padelectrodes PDs2 a of the flexible printed circuit board FPC.

The driving lines DL and the sensing lines SL may be disposed in anon-active area positioned at an outer side of an active area, in whichan image is displayed, but are not limited thereto.

FIG. 9 is a flowchart for describing a pressing method of the pressapparatus according to an exemplary embodiment of the presentdisclosure.

Referring to FIG. 9, the press apparatus 100 according to an exemplaryembodiment of the present disclosure may provide a first substrateconnected with a flexible printed circuit board onto a stage (S100), andprovide a second substrate onto the stage (S110).

The press apparatus 100 may dispose the flexible printed circuit boardFPC on the second substrate (S120).

The press apparatus 100 may press a lifted area AR of the flexibleprinted circuit board FPC by using the fixing member FM (S130), and maypress a pad portion of the flexible printed circuit board FPC and a padportion of the second substrate to each other (S140).

The present disclosure has been described with reference to someexemplary embodiments illustrated in the drawings, but the exemplaryembodiments are only illustrative, and it is to be appreciated by thoseskilled in the art that various modifications and equivalent exemplaryembodiments may be made. Accordingly, the actual scope of the presentdisclosure is to be determined by the spirit of the appended claims.

What is claimed is:
 1. A press apparatus comprising: a stage to supporta first substrate and a second substrate of a display device; a fixingmember to fix a flexible printed circuit board connected with the firstsubstrate onto the second substrate; and a press member to press firstpad electrodes of the flexible printed circuit board and second padelectrodes of the second substrate, wherein the fixing member isconfigured to press a pad electrode-free area of the flexible printedcircuit board.
 2. The press apparatus of claim 1, wherein the fixingmember includes a press jig to press the pad electrode-free area.
 3. Thepress apparatus of claim 2, wherein the press jig includes a firstsurface contactable with the pad electrode-free area, and a secondsurface surrounding the first surface.
 4. The press apparatus of claim3, wherein the first surface is a planar surface.
 5. The press apparatusof claim 3, wherein the first surface is a curved surface.
 6. The pressapparatus of claim 2, wherein the press jig is shiftable in a directionvertical to the stage or is shiftable in a direction parallel to thestage.
 7. The press apparatus of claim 6, wherein the press jig iscontactable with the pad electrode-free area, and then is shiftabletoward the first substrate.
 8. The press apparatus of claim 1, whereinthe fixing member includes a guide pin passable through a first couplinghole formed in the flexible printed circuit board and a second couplinghole formed in the second substrate.
 9. The press apparatus of claim 8,wherein a part of the guide pin is configured to press the padelectrode-free area.
 10. The press apparatus of claim 1, wherein atleast one of the first substrate or the second substrate is flexible.11. The press apparatus of claim 8, wherein the first pad electrodes,the first coupling hole, and the pad electrode-free area aresequentially located toward the first substrate.
 12. The press apparatusof claim 1, wherein the first substrate is a touch substrate, and thesecond substrate is a touch circuit substrate driving the touchsubstrate.
 13. A pressing method of a press apparatus, the methodcomprising: providing a first substrate connected with a flexibleprinted circuit board onto a stage; providing a second substrate ontothe stage; arranging the flexible printed circuit board on the secondsubstrate; pressing a pad electrode-free area of the flexible printedcircuit board; and pressing first pad electrodes of the flexible printedcircuit board and second pad electrodes of the second substrate.
 14. Thepressing method of claim 13, wherein the pressing of the padelectrode-free area includes: passing a guide pin through a firstcoupling hole formed in the flexible printed circuit board and a secondcoupling hole formed in the second substrate; and pressing the padelectrode-free area by using the guide pin.
 15. The pressing method ofclaim 13, wherein the pressing of the pad electrode-free area includespressing the pad electrode-free area of the flexible printed circuitboard by using a press jig.
 16. The pressing method of claim 15, whereinthe pressing of the pad electrode-free area of the flexible printedcircuit board by using the press jig includes: contacting the padelectrode-free area with the press jig; and shifting the press jigtoward the first substrate.
 17. A press apparatus comprising: a stage tosupport a first substrate and a second substrate of a display device; aguide pin to fix a flexible printed circuit board connected with thefirst substrate onto the second substrate; a press member to press firstpad electrodes of the flexible printed circuit board and second padelectrodes of the second substrate; and a press jig to press a padelectrode-free area of the flexible printed circuit board.
 18. The pressapparatus of claim 17, wherein the guide pin is passable through a firstcoupling hole formed in the flexible printed circuit board and a secondcoupling hole formed in the second substrate.
 19. The press apparatus ofclaim 17, wherein the first substrate is a touch substrate, and thesecond substrate is a touch circuit substrate driving the touchsubstrate.
 20. The press apparatus of claim 18, wherein the first padelectrodes, the first coupling hole, and the pad electrode-free area aresequentially located toward the first substrate.